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Diakopto has been recognized by Semiconductor Review Magazine as “Top 20 Semiconductor Tech Companie - 2021” based on our proprietary methodology, reflecting its position in the industry. This profile has been developed by the Semiconductor Review research and editorial team based on insights from an interview with Maxim Ershov, Co-founder, CEO and CTO.
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Diakopto was founded on the premise that parasitics are now a first-order problem, and require a different class of design solutions. The company’s ParagonX solution embodies a new methodology to help engineers develop next-generation chips more effectively and efficiently. The game-changing Diakopto methodology has taken the industry by storm, already having been adopted by over 35 industry-leading customers, including some of the largest semiconductor companies, system OEMs and hyperscale data center corporations.
Diakopto’s ParagonX delivers a set of functionalities that dramatically accelerate IC design debugging and optimization. It helps users analyze, visualize and debug a broad range of problems caused by layout parasitics. The tool provides engineers with an understanding of parasitic effects so they can more quickly and intelligently identify the root causes of circuit problems caused by interconnects. “We help engineers find the proverbial needle in a haystack—the handful of most critical elements out of millions that are responsible for bottlenecks, choke points and weak areas,” states Ershov. Diakopto solutions are designed to be orders of magnitude faster and offer unprecedented ease-of-use compared to alternate solutions. With no complicated setup/configuration or CAD support needed and virtually no learning curve required, users can achieve tremendous productivity gains the same day of starting to use Diakopto’s tool.
Diakopto has been instrumental in solving the previously unsolved problem of assisting engineers tasked with parasitics debugging, design optimization, and verification of today’s and tomorrow’s complex IC designs. Diakopto recently introduced its second product, and is expecting to introduce additional products over the next 12 months. “To meet the needs of our growing customer base, we have further accelerated our innovations and investment in R&D by dramatically growing the size of our engineering team in 2021,” concludes Ershov.
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Company
Diakopto
Management
Maxim Ershov, Co-founder, CEO and CTO
Description
Diakopto was founded on the premise that parasitics are now a first-order problem, and require a different class of design solutions. The company’s ParagonX solution embodies a new methodology to help engineers develop next-generation chips more effectively and efficiently. The game-changing Diakopto methodology has taken the industry by storm, already having been adopted by over 35 industry-leading customers, including some of the largest semiconductor companies, system OEMs and hyperscale data center corporations
Key Highlights
• The addition of Diakopto's solutions to Ansys' portfolio will deliver a competitive edge to engineers using Ansys to create high-performance integrated circuits
• Diakopto's unique and market-leading products complement Ansys' existing solutions – the combination will empower our customers to deliver optimal designs and accelerate time to market
• The transaction is subject to the satisfaction of customary closing conditions and is expected to close in the second quarter of 2023
PITTSBURGH, -- Ansys, (NASDAQ: ANSS) the global leader and innovator of engineering simulation software, announced today that it has entered into a definitive agreement to acquire Diakopto. A provider of differentiated EDA solutions to accelerate integrated circuit (IC) development, Diakopto focuses on helping resolve critical issues caused by layout parasitics. The transaction is subject to the satisfaction of customary closing conditions and is expected to close in the second quarter of 2023. It is not expected to have a material impact on Ansys' consolidated financial statements in 2023.
Diakopto develops products that address the growing complexities and unintended effects of designing ICs in the modern era. Semiconductor designs increasingly employ advanced process node technologies, where interconnect parasitic effects limit the performance, reliability, and functionality of designs. Diakopto's market-leading products have been adopted by dozens of customers, including tier-one semiconductor companies, for a broad range of applications.
With the acquisition, Ansys will better enable design engineers to "shift left," and to detect interconnect parasitic problems early in the design cycle. Diakopto's products provide actionable analytics to guide designers to fix these problems – a capability that has not existed before. Through early identification and what-if analysis of parasitic problems, engineers can minimize costly iterations late in the design cycle – furthering cost and time savings.
"Diakopto's culture of strong engineering excellence and its innovative and highly differentiated products create a natural alignment with our organization. We are eager to welcome their team to the Ansys family," said Shane Emswiler, senior vice president of products at Ansys. "Incorporating Diakopto's unique methodology will support designers using Ansys to quickly and easily pinpoint the few elements, out of billions, causing bottlenecks. Designers can then optimize and debug designs more efficiently for enhanced IC performance and reliability, and accelerate time to market. The acquisition will complement Ansys' existing offerings for engineers at every level as Diakopto's intuitive and out-of-the-box experience doesn't require extensive training or complicated setups or configurations."
"Today's announcement brings together two like-minded companies on the forefront of innovation, and we are excited about becoming part of the Ansys family," said Maxim Ershov, CEO and CTO at Diakopto. "By joining forces with Ansys, we're confident that we can solve a broader set of problems in the chip design workflow together, strengthening offerings for our customers and driving more innovations in high-tech designs for data center, 5G, automotive, and mobile applications."